Integrated design platform

Model, mesh, simulate, and optimize 3D devices in one workspace.

Planck Labs is building the end-to-end design platform for photonic, semiconductor, metasurface, and RF engineering — bringing geometry, meshing, multiphysics simulation, and design optimization into a single tool.

Method

Unknowns live where the material lives.

Device Geometry

Represent electromagnetic response on semiconductor, dielectric, and photonic structure volume.

Radiating Kernels

Use integral operators for open-domain fields and scattering behavior.

Design Optimization

Move geometry and material parameters through optimization loops.

Why Planck

A production high-order EM solver for high-frequency, high-contrast 3D devices.

Built for inhomogeneous, high-contrast, high-frequency problems that strain mainstream methods.

(k₀h)^p error scaling

Error stays bounded per wavelength regardless of electrical size.

Material as design variable

ε(r) and μ(r) optimize alongside shape.

True jumps, unaligned interfaces

Sharp material discontinuities. No staircase, no conformal meshing.

GPU acceleration

Runs on GPU.

Method comparison

FDTDFEMSurface MoMPlanck
Convergence order (3D)p = 2 (Yee)p = 2 defaultp ≈ 1.5 (RWG)p ≥ 6 (configurable)
DOF increase for 10× lower error≈ 32×≈ 32×≈ 100× (RWG)≤ 3×
Asymptotic compute (3D)O(N^4/3)O(N^3/2)O(N log N) (MLFMM)O(N log N)
Mesh empty spaceYesYesNoNo
Open-domain radiationNeeds PMLNeeds PMLAnalyticalAnalytical
Inhomogeneous mediaYesYesHybrid onlyNative
Sharp material jumpsStaircaseMesh-conformaln/a (surface)Unaligned, true
High-frequency dispersionGrows with sizePollution effectPollution-free(k₀h)^p, pollution-free
GPU accelerationYesYes (recent)LimitedYes

Method-class characterizations reflect well-known mathematical properties of FDTD, FEM, and MoM under default solver settings. DOF cost shown for one-decade error reduction in 3D, where N scales as F^(3/p). Asymptotic compute scaling assumes appropriate acceleration techniques (MLFMM / FMM / FFT) and well-conditioned formulations with mesh-independent iteration counts. Per-vendor higher-order or specialized options exist but are rarely run in production. Specific products and capabilities cited as of 2026; capabilities of named products may evolve. Comparison shown for the underlying solver class, not for any specific commercial implementation.

Applications

Built for small features, high frequencies, and coupled fields.

Silicon Photonics

Waveguides, bends, couplers, resonators.

Metasurfaces

Periodic media, phase masks, metalenses.

Semiconductor RF

Packages, interconnects, high-frequency devices.

Inverse Design

Geometry and material optimization across device parameters.

Workflow

From device description to optimized response.

01

Geometry

02

Materials

03

Solve

04

Optimize

Contact

Bring a representative device problem.

Geometry, material stack, frequency or wavelength band, and target response are enough to start.